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    Home»Uncategorized»InfoComm 2012: New TI Chipset for 3D
    Uncategorized

    InfoComm 2012: New TI Chipset for 3D

    AV NewsBy AV NewsJune 15, 2012Updated:July 13, 2018No Comments2 Mins Read
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    Texas Instruments unveiled a new family of image processing chips designed for front projectors, which enable broader standardisation of 3D and interactive technologies. Projectors with the new chipset design, which will be incorporated in shipping units starting late summer 2012, is said to  display content from common 3D-formats supported by HDMI 1.4, from virtually any mobile device including tablets, smart phones, laptops and Blu-ray players.

    The chipset allows projectors to work with any standard input-format as well as any light source, at any resolution, including XGA, SVGA, WXGA, 1080p and WUXGA.

    “Creating a chipset that makes 3D and interactive technologies more accessible for projector developers is a major step forward for the industry,” said Roger Carver, General Manager, DLP Front Projection. “This helps our customers build off-the-shelf projectors while adding new capabilities at a comparable price point that allows for global deployment while still serving unique regional needs.”

     “The display industry has evolved beyond the days of the higher resolution chase and the brightness battles,” added Carver. “As projectors increasingly become the central hub of the classroom, this new chipset will help optimise hardware and software for the new frontiers of interoperability, 3D and interactive display.”

    As the adoption of lamp-free, 3D and interactive technologies continues to increase in the classroom, ease of connectivity and deployment is another major benefit of the new chipset, allowing end users to run downloadable content from a laptop, tablet or other mobile device, while still supporting standard formats like Blu-ray and DVD, enhancing the ability of teachers to transition between content sources.

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